Lesale la ho Tsepamisa la Kamore ea Alumina e Hloekileng ka ho Fetisisa bakeng sa Litsamaiso tsa Plasma Etch le CVD
Lesale la ho tsepamisa maikutlo la kamore ea St.Cera ke karolo ea bohlokoa ea sesebelisoa sa ts'ebetso e sebelisoang lisebelisoa tsa semiconductor tsa plasma etch, CVD, le PVD. E entsoe ka alumina ea 99.8% e hloekileng haholo (Al₂O₃), lesale le potoloha lehlakore la wafer ho thibela plasma le ho ntlafatsa kabo ea ion angular, ka hona le ntlafatsa ho tšoana ha etch holim'a bokaholimo ba wafer. Thepa e fana ka khanyetso e ikhethang ea plasma, matla a phahameng a dielectric (15×10⁶ V/m), le botsitso ba mocheso ho fihlela ho 1600°C, ho netefatsa ts'epo ea nako e telele libakeng tsa plasma tse matla tse thehiloeng ho fluorine kapa chlorine. ID/OD e sitsitsoeng hantle le ho ba bataletse (≤10 μm) li nolofalletsa ho beha moeli oa wafer hantle, ho fokotsa liphoso tsa moeli le tlhahiso ea likaroloana.
Litlhaloso(ho ipapisitsoe le 99.8% Al₂O₃):
| Thepa | Boleng |
| Thepa | 99.8% Alumina (Lenaka la tlou) |
| Botenya | 3.93 g/cm³ |
| Ho Monya Metsi | 0% |
| Matla a ho Tenyetseha | 361 MPa |
| Ho Tiea ha ho Robeha | 3–4 MPa·m¹/² |
| Boima ba Vickers | 16 GPa |
| Modulus ea Young | 380 GPa |
| Ho khanna ha mocheso | 32 W/m·k |
| Katoloso ea Thermal (25–1000°C) | 7.2×10⁻⁶/℃ |
| Matla a Dielectric | 15×10⁶ V/m |
| Khanyetso e Ikhethang | >10¹⁴ Ω·cm |
| Mocheso o Moholo oa ho Sebetsa | 1600°C |
Likopo:
- · Masale a shebaneng le kamore ea ho tjhesa ka motlakase (oxide, nitride etch)
- · Masale a mathōko a kamore ea Silicon etch
- · Masale a lisebelisoa tsa ho lokisa kamore ea CVD
- · Thebe ea kamore ea PVD le masale a ho koala
Mokhoa oa Tlhahiso:
Phofo ea alumina e hloekileng haholo e hatelloa ka mokhoa o sa fetoheng → e entsoe ka botala ho fihlela sebopeho se batlang se le haufi le letlooa → e siloa ka mocheso oa 1600°C → Ho sila taemane ea CNC ea ID, OD, le botenya → ho lahlela ho fihlela ho bataletse ≤10 μm → ho hloekisa ka ultrasonic → tlhahlobo ea 100% CMM. Qetello ea bokaholimo Ra ≤0.4 μm e fokotsa ho khomarela ha likaroloana.
Taolo ea Boleng:
- · Tlhahlobo ea 100% ea litekanyo (ID, OD, botenya, ho tšoana)
- · Teko ea ho petla ha dae bakeng sa mapetso a manyenyane (ha ho mapetso a lumelloang)
- · Tlhahlobo ea pono tlas'a microscope ea 20× — ha ho na li-chips, voids, kapa 'mala o sootho
- · Teko ea matla a dielektri ka ASTM D149 (sampole)
Melemo ho feta masale a Silicon kapa Quartz Focus:
- · Nako ea bophelo e telele ka 5–10× plasma ea fluorocarbon
- · Ha ho dikarolwana tse ka jewang tsa kgoholeho ya mobu tse ka silafatsang di-wafer
- · Matla a phahameng a dielectric a thibela ho thibana ha di-arches
- · E boloka ho ba bataletse le ho nepahala ha boholo ba RF nakong ea lihora tse likete
Thepa e 'Ngoe — Zirconia e Tsitsitseng ea Yttria (ZrO2)₂):
Bakeng sa lits'ebetso tse hlokang ho tiea ho hoholo ha ho robeha (mohlala, likamore tse nang le potoloho e tloaelehileng ea mocheso kapa ho ts'oaroa ha mechini), mehele ea ho tsepamisa maikutlo ea ZrO₂ (botenya ba 6.03 g/cm³, matla a ho flexural 1000 MPa, ho tiea ha ho robeha 5–8 MPa·m¹/²) ea fumaneha. Leha ho le joalo, alumina e fana ka ts'ebeliso e ntle ea litšenyehelo 'me ke tekanyetso ea indasteri bakeng sa lits'ebetso tse ngata tsa mehele ea ho tsepamisa maikutlo.
Ho iketsetsa:
- · Liprofaele tsa litepisi, li-counterbore, kapa masoba a ho kenya ka setšoantšo sa moreki
- · Sekoahelo sa Y₂O₃ bakeng sa khanyetso e matla ea khoholeho ea plasma (botenya ba 20–100 μm)
- · Ho tšoaea nomoro ea karolo ka laser, khoutu ea letsatsi, kapa matšoao a ho hokahanya
Hlokomela:Lintlha tsohle li latela ka tieo tafole ea thepa ea Al₂O₃ e fanoeng. Bakeng sa litlhaloso tsa ZrO₂, sheba leqephe la data la zirconia le fanoeng. Meralo ea lesale la ho tsepamisa maikutlo e ka hloka tumello ea patent - bareki ba ikarabella bakeng sa ho netefatsa litokelo tsa thepa ea kelello.
