lebanta_la_page

Alumina Ceramic Core e Hloekileng Haholo bakeng sa Lisebelisoa tsa Semiconductor

Alumina Ceramic Core e Hloekileng Haholo bakeng sa Lisebelisoa tsa Semiconductor

Tlhaloso e Khutšoanyane:

Karolo ea motheo ea ceramic ea St.Cera e entsoe ka ho nepahala ho tsoa ho 99.8% Al₂O₃ e hloekileng haholo, e fanang ka matla a ikhethang a dielectric (15×10⁶ V/m), botsitso ba mocheso ho fihlela ho 1600°C, le khanyetso ea ho thekesela tlas'a mojaro. Likarolo tsena li sebelisoa e le likarolo tsa sebopeho linthong tsa ts'ebetso ea mocheso o phahameng, li-heater bases, li-liners tsa kamore ea plasma le li-insulator tsa motlakase. Bothata bo phahameng ba thepa (16 GPa) le ho monngoa ha metsi a tlase (0%) li netefatsa ts'epo ea nako e telele libakeng tse thata.


Qaqiso ea Sehlahisoa

Li-tag tsa Sehlahisoa

Karolo ea motheo ea ceramic ea St.Cera e entsoe ka ho nepahala ho tsoa ho 99.8% Al₂O₃ e hloekileng haholo, e fanang ka matla a ikhethang a dielectric (15×10⁶ V/m), botsitso ba mocheso ho fihlela ho 1600°C, le khanyetso ea ho thekesela tlas'a mojaro. Likarolo tsena li sebelisoa e le likarolo tsa sebopeho linthong tsa ts'ebetso ea mocheso o phahameng, li-heater bases, li-liners tsa kamore ea plasma le li-insulator tsa motlakase. Bothata bo phahameng ba thepa (16 GPa) le ho monngoa ha metsi a tlase (0%) li netefatsa ts'epo ea nako e telele libakeng tse thata.

 

Litlhaloso(ho ipapisitsoe le 99.8% AlO):

Thepa Boleng
Thepa 99.8% Alumina (Lenaka la tlou)
Botenya 3.93 g/cm³
Matla a ho Tenyetseha 361 MPa
Ho Tiea ha ho Robeha 3–4 MPa·m¹/²
Boima ba Vickers 16 GPa
Modulus ea Young 380 GPa
Ho khanna ha mocheso 32 W/m·k
Katoloso ea Thermal (25-1000°C) 7.2×10⁻⁶/℃
Matla a Dielectric 15×10⁶ V/m
Khanyetso e Ikhethang >10¹⁴ Ω·mm²/m
Mocheso o Phahameng oa Ts'ebetso 1600°C

 

Likopo:

  • · Sehatsetsi sa mantlha bakeng sa li-reactor tsa epitaxial
  • · Sekoahelo sa kamore ea plasma le lipoleiti tsa sekoahelo
  • · Li-insulator tsa motlakase tse nang le motlakase o phahameng
  • · Motheo oa thepa bakeng sa liroboto tse sebetsanang le wafer

 

Tlhahiso:

Ho tobetsa ka tsela e sa fetoheng → ho tjhesa ka botala → ho sila ka mocheso wa 1600°C → ho sila ka CNC ho fihlela dibopehong tsa ho qetela (± mamello ya 0.01 mm). Karolo e nngwe le e nngwe ya motheo e hlahlojwa ka CMM le ho lemoha diphoso tsa ultrasonic.

 

Netefaletso ea boleng:

Setifikeiti sa ISO 9001:2015. Teko ea ho penyeletsa dae bakeng sa mapetso a bokaholimo; teko ea matla a dielectric ho latela ASTM D149.

 

AMelemo ho feta li-ceramic tse ling:

  • · Matla a dielektri a phahameng ho feta zirconia (15 khahlanong le <10×10⁶ V/m)
  • · Litšenyehelo tse tlase ho feta SiC bakeng sa lits'ebetso tse seng tsa plasma
  • · Ho hanyetsa lik'hemik'hale hantle haholo ho li-halogen (ntle le HF)

 

Dibopeho tse Ikgethileng:

Lisilindara, mekoallo e sekwere, lipoleiti, kapa li-geometri tse rarahaneng. Boholo ba karolo bo bonyane ke 0.5 mm.

 

Ikopanye le rona bakeng sa meralo ea mantlha e ikhethileng le tšehetso ea ketsiso ea mocheso.


  • E fetileng:
  • E 'ngoe: